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Dr. Sandip Bhattacharya - Associate Professor & Head, (ECE)
WebPresents both compact analytical models and fast SPICE based 3-D electro-thermal simulation methodology to characterize thermal effects due to Joule heating in high performance Cu/low-k interconnects under steady-state and transient stress conditions. The results agree with experimental data and those using finite element (FE) thermal … WebNov 30, 2024 · Frequency Domain Analysis of Transmission Zeroes on High-Speed Interconnects in the Presence of an Orthogonal Metal Grid Underlayer Advanced Packaging, IEEE Transactions on nov. 2008 This paper addresses the topic of high-speed interconnects in high density systems [systems on chip (SoCs), systems in package … t-slot structural framing design services
On the Applicability of Single-Walled Carbon Nanotubes as VLSI ...
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